10070 CHAPTER 10. CONTROL-SYSTEM DESIGN: PRINCIPLES AND CASE STUDIES
Figure 10.98: RTP system.
20. Design and build a Sun tracker using an Arduino board and related software.
Solution: See several prototypes on the Internet.
21. Run-to-Run Control: Consider the rapid thermal processing (RTP) system shown in Fig. 10.98.
We wish to heat up a semiconductor wafer, and control the wafer surface temperature accurately using
rings of tungsten halogen lamps. The output of the system is temperature Tas a function of time,
y=T(t). The system reference input Ris a desired step in temperature (700C) and the control
input is lamp power. A pyrometer is used to measure the wafer center temperature. The model of
the system is first order and an integral controller is used as shown in Figure 10.98. Normally, there
is not a sensor bias (b= 0).
a. Suppose the system suddenly develops a sensor bias b6= 0, where bis known. What can be done
to ensure zero steady-state tracking of temperature command Rdespite the presence of the sensor
bias?
1. (a) Now assume b= 0. In reality, we are trying to control the thickness of the oxide film
grown (Ox) on the wafer and not the temperature. At present no sensor can measure Ox
in real time. The semiconductor process engineer must use an off-line equipment (called
metrology) to measure the thickness of the oxide film grown on the wafer. The relationship
between the system output temperature and Ox is nonlinear and given by
Oxide thickness =Ztf
0
pec
T(t)dt;
where tfis the process duration, and pand care known constants. Suggest a scheme
in which the center wafer oxide thickness Ox can be controlled to a desired value (say,
Ox = 5000 Å) by employing the temperature controller and the output of the metrology.
Solution: