PROBLEM 8.85 (Cont.)
The outlet temperature follows from Eq. (8.45b),
The heat rate per channel is then
and the chip power dissipation is
(b) The foregoing result indicates significant heat transfer from the channel side walls due to the large
value of
h
f. If the pitch is reduced by a factor of 2 (S = 100
µ
m), we obtain
Hence, although there is a reduction in
h
f due to the reduction in
δ
(
h
f = 0.89) and therefore a slight
reduction in the value of ql, the effect is more than compensated by the increase in the number of
COMMENTS: (1) Because electronic devices fail by contact with a polar fluid such as water, great
care would have to be taken to hermetically seal the devices from the coolant channels. In lieu of
water, a dielectric fluid could be used, thereby permitting contact between the fluid and the
electronics. However, all such fluids, such as air, are less effective as coolants. (2) With L/Dh = 125
and L/Dh)fd ≈ 0.05 ReD Pr = 273, fully developed flow is not achieved and the value of h = hfd
underestimates the actual value of
in the channel. The coefficient is also underestimated by using a
Nusselt number that presumes heat transfer from all four (rather than three) surfaces of a channel.