PROBLEM 7.83 (Cont.)
Consider the surface mount region as a semi–infinite medium, with solder properties, initially at a
uniform temperature of 25°C, that experiences sudden exposure to the convection process with the air
jet at a temperature T∞ = 500°C and the convection coefficient as found in part (a). The surface
temperature, T(0,t), is determined from Case 3, Fig. 5.7 and Eq. 5.63,
where α = k/rcp. With Ti = 25°C and T∞ = Te, by trial-and-error, or by using the appropriate IHT
model, find
(c) Using the foregoing relations in IHT, the surface temperature T(0,t) is calculated and plotted for jet
air temperatures of 400, 500 and 600°C for 0 ≤ t ≤ 40 s.
The effect of increasing the jet air temperature is to reduce the time for the surface
temperature to reach the solder temperature of 183°C. With the 700°C air jet, it takes about
14 s to reach the solder temperature, and the glass transition temperature is achieved in 35 s.
The analysis represents a first–order model giving approximate results only. While the
COMMENTS: (1) Note that for our application, the round nozzle correlation of part (a)
exceeds the ranges of validity.