PROBLEM 5.28 (Cont.)
COMMENTS: (1) For the aluminum on the top, the Biot number associated with the aluminum is BiB
= hLB/kB = (40 W/m2K 10 10–3 m)/237 W/mK = 0.0017. The lumped capacitance approach is
valid for the aluminum. For the copper, the contact resistance and the conduction resistance through
the top aluminum layer pose thermal resistances in series with the convective resistance. In addition,
the thermal conductivity of copper is greater than that of the aluminum, so lumped capacitance
behavior is also expected for the copper. For the copper on top, the Biot number for the copper is BiA =
0.0010. Lumped capacitance behavior will also exist for this configuration. (2) The thermal responses
for the two cases are shown below. Can you explain the differences?
(3) At t = 44.6 s, the temperature of the copper in part (a) is TA(t = 44.6s) = 107.1C. At t = 44.6 s, the
temperature of the bottom aluminum in part (b) is TB = 113.9C. Hence, the increase in thermal energy
of both materials per unit area during the first 44.6 s of heating for part (a) is Est = LAcA[TA(t = 44.6
//Dimensions
LA = 10/1000 //m
LB = 10/1000 //m
//Properties
cA = 385 //Copper specific heat, J/kgK
rhoA = 8933 //Copper density, kg/m^3
cB = 903 //Aluminum specific heat, J/kgK
rhoB = 2702 //Aluminum density, kg/m^3
Material Temperature versus Time
Material Temperature versus Time