3-203 An electronic device is cooled by dissipating heat through a heat sink attached on its top surface. There is contact
resistance at the interface of the electronic component and the heat sink. The surface temperature of the electronic device is to
be determined whether it is below 85°C or not.
Assumptions 1 Steady operating conditions exist. 2 Heat transfer is one-dimensional.3The electronic device maintains a
constant surface temperature.
PropertiesThe thermal contact conductance for aluminum plates with air at the interface, a roughness of about 10 μm and an
average interface pressure of 1 atm is hc = 3640 W/m2K (Table 3-1), the combined thermal resistance of an HS 5030 heat
sink, attached horizontally, is 1.2 K/W (Table 3-6).
AnalysisThe thermal resistances of different layers are
Since the surface temperature of the electronic device is above 85°C, there is a risk of overheating. To reduce the surface
temperature, the total thermal resistance needs to be reduced to promote more heat dissipation through the heat sink. One way
to solve this problem is by reducing the contact resistance at the interface. This can be achieved by filling the interface with a
fluid having higher thermal contact conductance than air.
sinkheat
total 1R
Ah
TT
R
T
c
s
+
−
1
−
−
−
Q
TT
K W/m250,11
W
K
2.1
45
3085
)m 040.0)(m 100.0( 2
1
=
−
−
=
−
c
h
Thus, the surface temperature of the electronic device can be reduced to below 85°C by filling the interface with a fluid
having a thermal contact conductance value higher than 11,250 W/m2K. From Table 3-1 hydrogen, silicone oil and glycerin
all have thermal contact conductance greater than 11,250 W/m2K.
DiscussionIn practice, the interfaces between electronic devices and heat sinks are filled with thermally conductive epoxy
adhesives to reduce thermal contact resistance.