Chapter 38: Printed Circuit Board Fabrication
MULTIPLE CHOICE
1. ____ base material was used in the past for applications in which performance was not critical because
it was inexpensive.
a.
Epoxy fiberglass
c.
Ceramic
b.
Phenolic
d.
Teflon
2. The thickness of the copper on a printed circuit board is designated in ____.
a.
grams
c.
ounces
b.
millimeters
d.
centimeters
3. When digital logic or other designs that use high-pin-count chips are used, ____ trace layers are
required.
a.
one
c.
four
b.
two
d.
more than four
4. In creating a schematic diagram, signal flow should proceed from ____.
a.
top to bottom
c.
left to right
b.
bottom to top
d.
right to left
5. In creating a schematic diagram, voltage potentials are drawn with the highest voltage at the ____ of
the diagram and the lowest at the ____.
a.
top, bottom
c.
left, right
b.
bottom, top
d.
right, left
6. A(n) ____ is used to connect a lead from a component or connect a wire from an off-board component.
a.
paper doll
c.
autorouter
b.
jumper
d.
pad
7. Traces that are too thin are fragile and have ____ resistance than thick traces and handle ____ current.
a.
lower, more
c.
lower, less
b.
higher, less
d.
higher, more
8. In a typical color-code system, the color black signifies ____.
a.
board outline, holes, pads, and hardware
b.
connecting traces on the component side
c.
component electrical symbols and outlines
d.
through holes
9. In a typical color-code system, the color red signifies ____.
a.
component electrical symbols and outlines
b.
connecting traces on the component side
c.
through holes
d.
board outline, holes, pads, and hardware
10. ____ are designed to use the computer to lay out a printed circuit board.
a.
Jumpers
c.
Autorouter programs
b.
Pads
d.
Paper dolls
COMPLETION
1. Prior to the arrival of surface mount technology (SMT), there were two designated layers for through-
hole printed circuit boards: the ____________________ side and the solder side.
2. Most radio-frequency (RF) printed circuit boards have traces on only one side, although a second layer
is used as a ____________________ to improve performance.
3. ____________________ connect the top to the bottom trace of a printed circuit board.
SHORT ANSWER
1. Describe the purpose(s) of the solder mask layer.
2. Describe how one can expedite the generation of a schematic diagram.
