Chapter 25: Integrated Circuits
MULTIPLE CHOICE
1. ____ is probably most famous for his invention of the integrated circuit, for which he received the
Nobel Prize in Physics in the year 2000.
a.
Jack Kilby
c.
Robert Noyce
b.
Geoffrey W. A. Dummer
d.
Royal Fairchild
2. ____ integrated circuits are constructed in the same manner as transistors but include a few additional
steps.
a.
Thick-film
c.
Monolithic
b.
Thin-film
d.
Hybrid
3. ____ integrated circuits are formed on the surface of an insulating substrate of glass or ceramic,
usually less than an inch square.
a.
Hybrid
c.
Monolithic
b.
Thick-film
d.
Thin-film
4. Diode and transistor chips are formed using the ____ technique.
a.
thin-film
c.
thick-film
b.
monolithic
d.
hybrid
5. In ____ construction, the resistors, capacitors, and conductors are formed on the substrate using a
screen printing process.
a.
thick-film
c.
monolithic
b.
thin-film
d.
hybrid
6. If only a few circuits are to be made, it is cheaper to use ____ integrated circuits.
a.
monolithic
c.
thin-film
b.
hybrid
d.
thick-film
7. The most popular package design for integrated circuits is the ____.
a.
flat pack
c.
plastic quad flat package
b.
dual-inline package
d.
thin small outline package
8. A ____ is a package design used for devices with a minimum number of inputs and outputs. It is used
mostly with monolithic integrated circuits.
a.
thin small outline package
c.
DIP
b.
flat-pack
d.
mini-DIP
9. A ____ is a package design used where space is limited. It is made from metal or ceramic and operates
in a temperature range of –55 to +125 degrees celsius.
a.
flat-pack
c.
thin small outline package
b.
mini-DIP
d.
plastic quad flat package
10. ESD is commonly experienced more during the ____ months when the environment is dry.
a.
winter
c.
summer
b.
spring
d.
fall
COMPLETION
1. The ____________________ is the maximum number of usable integrated circuits compared with the
rejects.
2. The ____________________ process requires that the material deposited on the substrate be placed in
a vacuum and heated until it evaporates.
3. A(n) ____________________ is a thin chip consisting of hundreds to millions of interconnected
semiconductor devices such as transistors, resistors, and capacitors.
SHORT ANSWER
1. List the factors that have made the integrated circuit popular.
2. Describe the process used to construct thick-film integrated circuits.
