Kaan Turan
ACWR 106
Valerie A. Taşıran
Summer 2013
COOLING SYSTEMS IN ELECTRONICS
INTRODUCTION
In recent years, technological devices are developed. Moreover, producers are trying to
improve new technological devices performances. These improvements in performance cause
overheating issue. Scientists pointed out that accumulation of heat in electronic devices is a
normal outcome. However, when accumulation of heat increases, it harms electronic devices
and decreases the performance of device. While performances of electronic devices are
developing, cooling methods should be improved. “The need for new cooling techniques is
driven by the continuing increases in power dissipation of electronic parts and systems” [1].
Because overheating is a significant challenge in electronic devices ranging from
microprocessors to big scale transformers. Chris Soule says that “The trick is to have efficient
cooling underneath modules.”[1]. As Chris Soule mentioned, in cooling systems design has
importance. A large amount of successful operations for cooling systems are available, based
on two main topics which are active and passive cooling. Active cooling systems force air to
be removed by using fans. While passive cooling systems do not use fans to spread the
accumulated heat. Passive cooling is expanded method of active cooling. In passive cooling,
designers mainly focus on to maximize the heat transportation and spreading the heat. Both
processes have unique advantages; however transporting the heat is more preferred and
efficient. “Standard fans” and “Synthetic’ Jet Cooling” techniques are working in principles of
active cooling method. “Nanolightning”, “Liquid-Cooled Cold Plates” and “Microchannel and
Minichannel Coolers” are types of passive cooling.